Design the Assembly and Packaging of a micromechanical device of gas analysis
$10-30 USD
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Opublikowano ponad 7 lat temu
$10-30 USD
Płatne przy odbiorze
I need someone specialized in Microsystems who can design the package of a micromechanical thermal device for gas analysis.
What matters to me is the assembly part, the interconnection technology, the materials used considering the operating temperature and other factors, excluding the electronic design of the circuits. I need a way to connect the ASIC microcontroller to the MEMS sensor heating plate. I need the housing levels which can resist high temperatures.
All the requirements are listed in the file uploaded below, I need them completed by design and calculations. This should not take a lot of time, it is just the projection of materials that I need and the optimization of them to secure a proper functioning of the system.
Happy bidding!